索引 D:\project.syant\0006Video\0001HALCON\hdevelop\Applications\Measuring-2D

上一目录..
名称大小修改日期
angio.hdev3 KB2010/7/30 20:06
ball_seq.hdev3 KB2010/7/23 15:46
check_fish_stick_dimension.hdev6 KB2010/7/12 21:29
circles.hdev2 KB2010/7/30 20:06
correct_measure_direction.hdev6 KB2010/8/20 16:12
determine_die_pitch_fft_correlation.hdev4 KB2010/7/12 21:29
die_01_params.tup2 KB2010/7/12 21:29
die_04_params.tup1 KB2010/7/12 21:29
die_05_params.tup1 KB2010/7/12 21:29
die_06_params.tup5 KB2010/7/12 21:29
die_07_params.tup1 KB2010/7/12 21:29
extract_clips_xl.hdev7 KB2010/8/20 16:12
fin.hdev2 KB2010/8/20 16:12
fuzzy_measure_pin.hdev8 KB2010/8/20 16:12
holes.hdev2 KB2010/8/20 16:12
hull.hdev2 KB2010/8/20 16:12
inspect_gasket_local_deformable.hdev7 KB2010/9/13 23:32
inspect_harddisk_temperature.hdev2 KB2010/8/20 16:12
measure_arc.hdev3 KB2010/8/20 16:12
measure_ball_bond.hdev6 KB2010/9/20 20:59
measure_circuit_width_lines_gauss.hdev6 KB2010/7/12 21:29
measure_diamond.hdev4 KB2010/9/13 23:32
measure_fill_level.hdev5 KB2010/9/13 23:32
measure_lcd_cells.hdev16 KB2010/7/30 20:06
measure_online.hdev2 KB2010/8/20 16:12
measure_pads_subpix.hdev9 KB2010/9/13 23:32
measure_pin.hdev5 KB2010/8/20 16:12
measure_tft_cells.hdev13 KB2010/7/30 20:06
particle.hdev3 KB2010/7/23 15:46
pm_measure_board.hdev8 KB2010/8/20 16:12
rim.hdev7 KB2010/7/30 20:06
segment_ball_bond_lead_frame.hdev5 KB2010/7/12 21:29
segment_wedge_bonds.hdev16 KB2010/7/30 20:06
track_wires_on_chip.hdev22 KB2010/7/30 20:06
vessel.hdev3 KB2010/7/30 20:06